Native thermal conductive diamond HTCD-AG (30~540μm)
The surface has undergone high purification treatment, improving the thermal boundary, which can achieve very low interfacial thermal resistance and high thermal conductivity, making it suitable for the production of high-end thermal interface materials.
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The company adoptsspecialproduction processes, and the produced diamond for thermal conductivity hasextremely low internal impurities (non-diamond carbon, nitrogen impurities, etc.), good thermal stability, few lattice defects, high hardness, and good wear resistance, among other excellent characteristics. The surface has undergone high-purity treatment, improving the thermal boundary, which can achieve very low interfacial thermal resistance and high thermal conductivity, making it suitable for the production of high-end thermal interface materials.
The grades are divided intoHTCD-AGT, HTCD-AGP, HTCD-AGH, HTCD-AGG, with particle sizes ranging from 30 to 540 μm.
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