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Diamond micropowder for silicon carbide cutting is a high-performance tool material used for cutting hard materials such as silicon carbide (SiC). With its high hardness, good wear resistance, uniform particle size, and excellent chemical stability, it is widely used in semiconductor material processing, photovoltaic industry, and precision machinery processing. When using, it is necessary to select the appropriate particle size, keep the tool sharp, and pay attention to safety protection.

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Features
* High-strength, high-brittleness diamond raw material
* Block crystal form, sharp edges and corners, high sharpness
* Concentrated particle size distribution
* Extremely low impurity content
* Strict control of large particles
* Very few long and flaky particles
* Many effective abrasive grains
 

Applications
Used in diamond cutting lines for SiC, sapphire wafers, quartz, liquid crystal glass, magnetic materials, jewelry and jade, etc.
Electroplated diamond precision grinding wheels, SiC crystal cutting fluid, ultra-thin wafering blades, etc.

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