Polycrystalline-like diamond
Patented product, PLM has the features of polycrystalline diamond, with highermaterial removal rate and better surface finish performance.
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Patented product, PLM has the features of polycrystalline diamond, with highermaterial removal rate and better surface finish performance.
* Excellent self-sharpening ability, continuously generates new edges duringinteracting with the workpiece.
* Less lapping pressure needed during work.
* Less residual debris left on the workpiece.
* Without limit of large sizes and volume quantity supply.
* Lower cost.
Applications:
* Neutral and clean, suitable for producing polishing slurry and other liquidpolishing products.
* Mainly used for fifine lapping and polishing on semiconductor industry ( sapphire,Si, SiC, GaN), electronic and IT industries, etc.
* Also recommended for fast grinding and high request on the surface roughnesson hard & brittle materials.
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