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WMM130

Vitrified bond, metal bond, electroplated system and highload resin bond.

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Characteristics

*High toughness diamond as rawmaterial

*Blocky crystal shape

*Narrow particle size distribution

*Low impurity

*Good surface finish

 

(Bonds)

Vitrified bond, metal bond, electroplated system and highload resin bond.

 

(Applications)

Precision grinding/polishing of brittle materials, like optical glass,ceramics,PCD, SiC, etc.

Producing high grade slurry and compound.

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