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Polycrystalline-like diamond

Patented product, PLM has the features of polycrystalline diamond, with highermaterial removal rate and better surface finish performance.

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Detail

Patented product, PLM has the features of polycrystalline diamond, with highermaterial removal rate and better surface finish performance.

 

* Excellent self-sharpening ability, continuously generates new edges duringinteracting with the workpiece.

* Less lapping pressure needed during work.

* Less residual debris left on the workpiece.

* Without limit of large sizes and volume quantity supply.

* Lower cost.

 

Applications:

* Neutral and clean, suitable for producing polishing slurry and other liquidpolishing products.

* Mainly used for fifine lapping and polishing on semiconductor industry ( sapphire,Si, SiC, GaN), electronic and IT industries, etc.

* Also recommended for fast grinding and high request on the surface roughnesson hard & brittle materials.

 

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